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What is Oxygen Free Copper?
Below 5ppm of Oxygen content Copper being applied for main wiring material for TFT LCD, High precision Electronics & Electric devices, Nuclear devices etc.
COMET’s Oxygen Free Copper
High purity Oxygen Free Copper, Class 1
Establishing Continuous Casting System of Class 1, Oxygen Free Copper.
Establishing the integrated Oxygen Free Copper manufacturing system from Hot Rolling to Machining
Elements | O | P | Sb | As | Bi | Cd | Fe | Pb | Mn | Ni | Se | Ag | S | Te | Sn | Zn |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
C1011/C10100 | ≤5 | ≤3 | ≤4 | ≤5 | ≤1 | ≤1 | ≤10 | ≤5 | ≤0.5 | ≤10 | ≤3 | ≤25 | ≤15 | ≤2 | ≤2 | ≤1 |
Comet OFC | ≤1 | ≤1 | ≤3 | ≤1 | ≤1 | ≤0.5 | ≤3 | ≤3 | ≤0.3 | ≤2 | ≤1 | ≤15 | ≤10 | ≤1 | ≤1 | ≤1 |
Elements | O | P | Sb | As | Bi | Cd | Fe | Pb |
---|---|---|---|---|---|---|---|---|
C1011/C10100 | ≤5 | ≤3 | ≤4 | ≤5 | ≤1 | ≤1 | ≤10 | ≤5 |
Comet OFC | ≤1 | ≤1 | ≤3 | ≤1 | ≤1 | ≤0.5 | ≤3 | ≤3 |
Elements | Mn | Ni | Se | Ag | S | Te | Sn | Zn |
---|---|---|---|---|---|---|---|---|
C1011 | ≤0.5 | ≤10 | ≤3 | ≤25 | ≤15 | ≤2 | ≤2 | ≤1 |
Comet OFC | ≤0.3 | ≤2 | ≤1 | ≤15 | ≤10 | ≤1 | ≤1 | ≤1 |
Class 1 OFC Appication
LCD & Semi-con. Target
Bus-bars & Motor
Magnetron Anode of Microwave
Car Electronic Devices
The High-end Audio Cable and Ultra-fine Line
Superconductor Wire
Electronic Conductor
TV & Radio Broadcasting Tube
X-Ray Tube etc.
Quality Comparison
Compare Item | Comet OFC | ToughPitch Copper | Remarks | |
---|---|---|---|---|
Specification | KS | C1011 | C1100 | |
UNS | C10100 | C11000 | ||
Content | Cu | ≥99.995 % | ≥99.9 % | |
O2 | ≤1ppm | 200-500ppm | ||
Impurity | Total below 40ppm | High impurities | ||
Metal structure | No oxides No defects(bubble etc.) |
Safurated with Copper oxide Many defects(bubble etc.) |
||
Electric conductivity |
IACS % | ≥101% | ≥98% | soft |
≥99% | ≥97% | hard | ||
Thermal conductivity | Excellent(400Wmk) | poor than OFC’s | ||
Mechanical properties |
strength | Equal to TP | Equal to OFC | |
Elongationpercentage | Better than TP(over 10%) | Below 90% vs OFC | ||
Recusive Flexing Characteristic |
Very good | poor than OFC’s | ||
Formability | Very good | poor than OFC’s | ||
Hydrogen Embrittlement |
High temperature, reduction atmosphere |
none | HIGH [concerend Material crack] |
TP is not applicable in Hydrogen process |
Volatility vacuum |
10 - 5 Torr | none | Vacum cash due to Volatile substance (O2, Cd, Te, Pb, Zn etc..) |
TP is not applicable in Vacuum process |
Weldability | Excellent (no gas component) |
poor (void caused from Oxygen and gas) |
TP is not applicable in Welding process |
|
Manufacturing process |
air-blocking casting system (remove Oxygen,Hydrogen |
Casting in air (Oxygen leak/Hydrogen)) |
||
Raw Materials | Electric Copper(99.995%) | Copper scrap(99.9%) |
OFC : Oxygen Free Copper__ Flawless Copper removed the Oxygen Content and Impurities